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ConferenceEngineering And Technology

International Conference on Thermal Management in Electronics and Microdevices

ICTMEM

Thu, Jul 30, 2026- Fri, Jul 31, 2026
Sepang, Malaysia

Deadline: Jul 10, 2026

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ICTMEM

Thu, Jul 30, 2026- Fri, Jul 31, 2026
Sepang, Malaysia

Deadline: Jul 10, 2026

Conference Overview

The main purpose of International Conference on Thermal Management in Electronics and Microdevices is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.

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Important Dates

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Start Date

Thursday, July 30, 2026

End Date

Friday, July 31, 2026

Registration Deadline

Wednesday, July 15, 2026

Submission Deadline

Friday, July 10, 2026

Conference Agenda
TimingSessions
09:00 AM – 09:30 AMRegistration & Welcome Coffee Kit Collection
09:30 AM – 09:45 AMNetworking Tea Break
09:45 AM – 10:30 AMOpening Plenary Session: Welcome Address & Keynote
10:30 AM – 01:00 PMSession I
01:00 PM – 01:30 PMLunch Break
01:30 PM – 04:00 PMSession II
04:05 PM – 04:15 PMGroup Photo & Final Networking Session
04:15 PM – 05:00 PMClosing Address: Reflections & Awards Presentation

Committee Members

Meet the distinguished experts guiding the conference.

Bishnu Pada Bose

Bishnu Pada Bose

Shashi Shekhar T R

Shashi Shekhar T R

Dejan Tanikic

Dejan Tanikic

Speakers

Learn from renowned speakers and industry leaders.

Arpan Kharva

Arpan Kharva

Manju Pawar

Manju Pawar

Mr. Vikas Reddy Penuballi

Mr. Vikas Reddy Penuballi

Organizer

SNRI

Alex Stewart
support@snrischolars.com

Indexed In

  • Scopus
  • DOI Directory
  • Google Scholar
  • Springer
Venue

Movenpick Hotel And Convention Centre Klia


Kompleks TH Sepang, Jalan Masjid Klia, 64000 Sepang, Selangor, Malaysia

Sepang, Malaysia

Quick Info
TypeConference
CountryMalaysia
MonthJuly-2026

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